RM 3 Processing for In - plane Optical Interconnects on Si - CMOS and the Impact of Topographic Features on Losses in Deposited Dielectric Waveguides
نویسنده
چکیده
This paper describes recent progress in a continuing program to develop and apply RM (recess mounting with monolithic metallization) technologies for heterogeneous integration. Particular emphasis is placed on the applicability of RM integration to in-plane geometries for on-chip optical clock and signal distribution and on the suitability of commercially processed IC wafers for use as substrates for rectangular dielectric waveguides.
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تاریخ انتشار 2003